Thermally absorbing chassis, electronic component, and method of fabricating heat absorbing chassis

Thermally absorbing chassis, electronic component, and method of fabricating heat absorbing chassis

A heat transmissive chassis for a fan-less equipment component such as a 5G component is disclosed. The chassis includes a heat sink section having an interior surface and an exterior surface. The interior surface is configured for contact with a heat-generating electronic device. A lateral hollow c...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: WANG, TEUAN, CHEN, YIIEH, WU, YUEHANG, TSENG, PO-KAI
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A heat transmissive chassis for a fan-less equipment component such as a 5G component is disclosed. The chassis includes a heat sink section having an interior surface and an exterior surface. The interior surface is configured for contact with a heat-generating electronic device. A lateral hollow compartment is located near the interior surface. A coolant is contained in the hollow compartment.