Apparatus for processing substrate

The present invention relates to a substrate processing apparatus including: a chamber; a substrate supporting unit for supporting a substrate in the chamber; a gas injection unit including a plurality of first injection holes injecting a first process gas toward the substrate, and a gas inflow unit...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KIM, JUN-YOUNG, CHA, SANG-YUN, LEE, JI-HUN
Format: Patent
Sprache:chi ; eng
Schlagworte:
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Beschreibung
Zusammenfassung:The present invention relates to a substrate processing apparatus including: a chamber; a substrate supporting unit for supporting a substrate in the chamber; a gas injection unit including a plurality of first injection holes injecting a first process gas toward the substrate, and a gas inflow unit for communicating with the first injection holes and allowing the first process gas to flow in; a gas supply unit for supplying the first process gas to the gas injection unit, the gas supply unit including a gas supply connection unit connected with the gas inflow unit; and a sealing unit for maintaining sealing between the gas inflow unit and the gas supply connection unit.