Substrate processing device and substrate processing method

A substrate processing device according to one aspect of the invention comprises a processing unit (40), a measurement unit (60), and a control section (31). The processing unit (40) holds one of the substrates in a composite substrate (T) in which an energy absorbing layer (E) is formed between a pair of substrates, while applying at least one or other of thermal energy and light energy to the energy absorbing layer (E) to release the other substrate. The measurement unit (60) measures the displacement of the other substrate in the processing unit (40). The control section (31) controls each section. Furthermore, the control section (31) determines whether the other substrate has been released based on the displacement of the other substrate.