A system and method for conveying and inspecting semiconductor package

Embodiments of the present invention generally relate to the field of semiconductor, in particular to a system (1) and method (1300) for conveying and inspecting semiconductor package. More particularly, the present invention relates to the post-seal inspection system (1) and method (1300) that perf...

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Bibliographische Detailangaben
Hauptverfasser:	BIN MEGAT MOHD AZLAN, MEGAT ABDULLAH, ONG, DENNIS YONG SHENG, KOK, YIK LOONG, KHAW, JUSON DUN LEE, KHOR, KER MING, CHIANG, YOONG FATT, FOO, JERROD SHENG CHUN, KANG, TEK PEI, TAI, JIA XUN, LEE, CHUZEN, ONG, SIANG LOONG, YEAP, CHIN LEE, TEE, KAI WEN, KIM, KEK KEONG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CONVEYING HANDLING THIN OR FILAMENTARY MATERIAL MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PACKING PERFORMING OPERATIONS PHYSICS PNEUMATIC TUBE CONVEYORS SHOP CONVEYOR SYSTEMS STORING TESTING TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING ORTIPPING TRANSPORTING
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Beschreibung
Zusammenfassung:	Embodiments of the present invention generally relate to the field of semiconductor, in particular to a system (1) and method (1300) for conveying and inspecting semiconductor package. More particularly, the present invention relates to the post-seal inspection system (1) and method (1300) that performs automatic conveyance of semiconductor package for inspection process.