Direct-pick robot for multi-station semiconductor processing chambers

Disclosed herein are direct-pick wafer handling robot systems that may be used to directly pick four wafers from, or directly place four wafers in, stations of a multi-station module, e.g., a quad-station module (QSM). Such wafer handling robot systems include two sets of robot arm pairs, with each robot arm pair able to be used independently of the other so that one robot arm pair may be used to pick wafers from a QSM while the other robot arm pair supports a set of four wafers to be placed into that same QSM once the wafers in the QSM are removed. Such wafer handling robot systems may allow for each wafer to be directly placed within each station of the QSM and can be adapted to allow each such wafer placement to be individually adjusted to allow each wafer to be centered on a respective target pedestal.