Electroplating cavity plating leakage early warning method and system

The invention provides an electroplating cavity plating leakage early warning method and system. The method comprises the following steps: positioning an electroplated wafer on a tool at a detection position; setting a target detection area of the wafer; operating an image sensor to detect the target detection area of the wafer, and judging whether unwanted metal deposits exist in the target detection area of the wafer or not; if the judgment result is that unwanted metal deposits exist in the target detection area of the wafer, the plating leakage phenomenon occurs in the electroplating cavity for processing the wafer, and an alarm instruction is sent out; and if the judgment result is that the unnecessary metal deposit does not exist in the target detection area of the wafer, the plating leakage phenomenon does not occur in the electroplating cavity for processing the wafer, and the alarm instruction is not sent out. According to the wafer plating leakage detection device, plating leakage detection is autom