Dicing/die-bonding film and semiconductor device manufacturing method

The present invention discloses a dicing/die-bonding film that comprises: a die-bonding film; and a dicing film that includes a pressure-sensitive adhesive layer which is adhered to the die-bonding film. The thickness of an adhesive layer is no more than 10 [mu]m. The thickness of the pressure-sensi...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	IWANAGA, YUKIHIRO, KIMURA, NAOHIRO, TAZAWA, TSUYOSHI, YAMAMOTO, KAZUHIRO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The present invention discloses a dicing/die-bonding film that comprises: a die-bonding film; and a dicing film that includes a pressure-sensitive adhesive layer which is adhered to the die-bonding film. The thickness of an adhesive layer is no more than 10 [mu]m. The thickness of the pressure-sensitive adhesive layer is less than 10 [mu]m. The dicing film may also include a substrate film. The pressure-sensitive adhesive layer may be disposed on the substrate film.