Sealing composition and electronic component device

A sealing composition contains an epoxy resin, a curing agent, an inorganic filler and a silicone compound, in which the silicone compound shows in a measurement of 1H NMR in CDCl3 that an integrated value of a chemical shift that appears between 3.0 ppm and 4.0 ppm of is 350 or less, assuming that...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	NEGORO, SHUHEI, FUSUMADA, MITSUAKI, TANAKA, MIKA, KANG, DONGCHUL, OSHITA, TSUYOSHI, UCHIYAMA, CHIKA, SUKEGAWA, YUTA, SHIRAGAMI, MASASHI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A sealing composition contains an epoxy resin, a curing agent, an inorganic filler and a silicone compound, in which the silicone compound shows in a measurement of 1H NMR in CDCl3 that an integrated value of a chemical shift that appears between 3.0 ppm and 4.0 ppm of is 350 or less, assuming that an integrated value of a shift that appears between -0.3 ppm and 0.3 ppm is 300.