Improving processing of a flexible circuit board (cb) using a vacuum plate adapted to the CB design
A system includes a plate and a vacuum source. The plate has a first surface and a second surface opposite the first surface, the plate is configured to receive on the first surface a flexible substrate including a first section having a first flexibility and a second section having a second flexibi...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | A system includes a plate and a vacuum source. The plate has a first surface and a second surface opposite the first surface, the plate is configured to receive on the first surface a flexible substrate including a first section having a first flexibility and a second section having a second flexibility different from the first flexibility, the plate has through-holes (TH), between the first and second surfaces, with a variable density that varies from a first pattern arranged in a first density opposite the first section to a second pattern arranged in a second density, different from the first density, opposite the second section. The vacuum source is configured to draw a vacuum in the TH between the first and second surfaces for fixing the first section to the first pattern and the second section to the second pattern. |
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