Semiconductor device and method of manufacturing semiconductor device wherein the semiconductor device includes an insulating member, a columnar electrode, a member, and an electrode

The present invention provides a semiconductor device and a manufacturing method of the semiconductor device capable of improving reliability. The semiconductor device of this embodiment includes: an insulating member having a first surface; a columnar electrode having at least one first metal layer and a second metal layer, wherein the at least one first metal layer extends into the insulating member in a direction substantially perpendicular to the first surface, and at least a portion of the first metal layer is exposed from the insulating member from the first surface, and at least a portion of the second metal layer is exposed from the insulating member and is disposed on the inside of the first metal layer; a member disposed on the first surface and arranged to overlap at least a portion of the first metal layer when viewed from a first direction substantially perpendicular to the first surface; and an electrode, which is disposed on the first surface to cover the member and is electrically connected to