Method of joining electrical and mechanical components using laminated modular preforms

A method of applying a sinterable film to a substrate during a surface mount technology (SMT) process, the method comprising: providing a substrate; providing a preform comprising a support film, the support film having a first surface and a second surface opposite the first surface, the support film being laminated with a sinterable film of metal particles on the first surface but not on the second surface; providing a pick-and-place machine comprising a placement head; picking up the preform via the second surface using the placement head of the pick-and-place machine, placing the preform in contact with the substrate using the pick-and-place machine, wherein the contact is via the sinterable film; attaching the sinterable film to the substrate; and separating the support film from the sinterable film.