Semiconductor packages and methods of manufacturing thereof
A semiconductor package includes a first die comprising a voltage regulator that has a first input and a second input. The semiconductor package includes a second die coupled to the first die and comprising a first load circuit. The voltage regulator is configured to provide a regulated voltage to t...
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | A semiconductor package includes a first die comprising a voltage regulator that has a first input and a second input. The semiconductor package includes a second die coupled to the first die and comprising a first load circuit. The voltage regulator is configured to provide a regulated voltage to the first load circuit through a first through via structure based on a first voltage received through the first input and a second voltage received from the first load circuit through a second through via structure. The first voltage is a constant reference voltage, and the second voltage is a first signal sensed from the first load circuit. |
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