Plasma processing method and plasma processing apparatus

To properly ignite plasma irrespective of processing conditions while suppressing a reduction in throughput. A plasma processing method comprises a step of performing control based on a processing recipe including a set parameter value for each of a plurality of processing parameters for processing...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: UEMATSU, HARUYUKI, SAITO, HITOSHI, TOMITA, TAKAHIRO
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:To properly ignite plasma irrespective of processing conditions while suppressing a reduction in throughput. A plasma processing method comprises a step of performing control based on a processing recipe including a set parameter value for each of a plurality of processing parameters for processing a substrate for each processing step. In the case where it has been determined that it is difficult to stably ignite the plasma by the control based on the processing recipe as a result of referring to predetermined ignition reference data, when performing the processing step including the ignition of the plasma, the control step performs control with part of the plurality of processing parameters replaced with predetermined ignition parameters different from the set parameter values until a predetermined stabilization time for the plasma to stabilize elapses, and performs control with the part of the processing parameters using the originally set parameter values after the stabilization time elapses.