Conductive paste and multilayer substrate

The present invention provides a conductive paste which is capable of forming a cured product that achieves high conductivity and long-term reliability at the same time. The present invention provides a conductive paste which contains, per 100 parts by mass of a liquid epoxy compound, 1,700 parts by...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	TSUDA, TSUYOSHI, NAKAZONO, HAJIME
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CONDUCTORS DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INSULATORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES PRINTED CIRCUITS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES USE OF MATERIALS AS ADHESIVES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The present invention provides a conductive paste which is capable of forming a cured product that achieves high conductivity and long-term reliability at the same time. The present invention provides a conductive paste which contains, per 100 parts by mass of a liquid epoxy compound, 1,700 parts by mass to 3,300 parts by mass of metal particles that include high melting point metal particles (B1) which contain silver and/or copper and have a melting point of 800 DEG C or higher, low melting point metal particles (B2) which are formed of an alloy having a melting point of 130 DEG C to 150 DEG C, and low melting point metal particles (B3) which are formed of an alloy of two or more metals selected from the group consisting of tin, silver, copper, bismuth and indium, and have a melting point of 200 DEG C to 240 DEG C, 1 part by mass to 30 parts by mass of a curing agent, and 20 parts by mass to 200 parts by mass of a flux.