Adhesive composition and laminate with adhesive layer
Provided is an epoxy-based adhesive composition excelling in re-dispersibility of a filler, having a re-peelable property in a B-stage state, and capable of forming an adhesive layer exhibiting excellent adhesive strength after a curing reaction. Also provided is a laminate with an adhesive layer in...
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| creator | OKIMURA, YUYA HIRAKAWA, MAKOTO KITA, SHINJI KONDO, TAKAHIRO |
| description | Provided is an epoxy-based adhesive composition excelling in re-dispersibility of a filler, having a re-peelable property in a B-stage state, and capable of forming an adhesive layer exhibiting excellent adhesive strength after a curing reaction. Also provided is a laminate with an adhesive layer in which the adhesive composition is used. |
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Also provided is a laminate with an adhesive layer in which the adhesive composition is used.</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CHEMISTRY CONDUCTORS DYES ELECTRICITY INSULATORS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES TRANSPORTING USE OF MATERIALS AS ADHESIVES |
| title | Adhesive composition and laminate with adhesive layer |
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