Adhesive composition and laminate with adhesive layer

Provided is an epoxy-based adhesive composition excelling in re-dispersibility of a filler, having a re-peelable property in a B-stage state, and capable of forming an adhesive layer exhibiting excellent adhesive strength after a curing reaction. Also provided is a laminate with an adhesive layer in...

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Bibliographische Detailangaben
Hauptverfasser:	OKIMURA, YUYA, HIRAKAWA, MAKOTO, KITA, SHINJI, KONDO, TAKAHIRO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CHEMISTRY CONDUCTORS DYES ELECTRICITY INSULATORS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES TRANSPORTING USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	Provided is an epoxy-based adhesive composition excelling in re-dispersibility of a filler, having a re-peelable property in a B-stage state, and capable of forming an adhesive layer exhibiting excellent adhesive strength after a curing reaction. Also provided is a laminate with an adhesive layer in which the adhesive composition is used.