Member for semiconductor manufacturing apparatus

Member for semiconductor manufacturing apparatus

A member 10 for semiconductor manufacturing apparatus has a ceramic plate 20 having a wafer placement surface 21 on its upper surface, and a porous plug 50 that allows a gas to flow. The porous plug 50 is disposed in a plug insertion hole 24 that penetrates the ceramic plate 20 in a up-down directio...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KUNO, TATSUYA, INOUE, SEIYA, OGISO, YUSUKE, YOTO, TAKUYA, NAGAE, TOMOKI
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A member 10 for semiconductor manufacturing apparatus has a ceramic plate 20 having a wafer placement surface 21 on its upper surface, and a porous plug 50 that allows a gas to flow. The porous plug 50 is disposed in a plug insertion hole 24 that penetrates the ceramic plate 20 in a up-down direction. The porous plug 50 has a first porous member 51 exposed to the wafer placement surface 21, and a second porous member 52 having an upper surface covered by the first porous member 51. The first porous member 51 is higher in purity and smaller in thickness than the second porous member 52. The second porous member 52 is higher in porosity than the first porous member 51.