Photosensitive resin composition, cured article, organic el display device, semiconductor device, and method for producing cured article

The present invention addresses the problem of providing a photosensitive resin composition that has high sensitivity, can be formed into a cured article having high bending resistance, and can achieve high reliability when the cured article is used in an organic EL display device. The photosensitiv...

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Bibliographische Detailangaben
Hauptverfasser:	KAMEMOTO, SATOSHI, ONIKI, JUMPEI, IKEDA, KEI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON ELECTRIC HEATING ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	The present invention addresses the problem of providing a photosensitive resin composition that has high sensitivity, can be formed into a cured article having high bending resistance, and can achieve high reliability when the cured article is used in an organic EL display device. The photosensitive resin composition comprises (A) an alkali-soluble resin, (B) a quinonediazide compound, (C) a thermal crosslinking agent, and (D) a thermal acid generator, in which the thermal crosslinking agent (C) comprises (C1) a thermal crosslinking agent having a phenolic hydroxyl group and also having a methylol group and/or an alkoxymethyl group in the molecule thereof and (C2) a thermal crosslinking agent having an epoxy group.