Polyimide precursor composition, polyimide film, multilayer film, flexible metal clad laminate and electronic parts including the same

The present invention provides a polyimide film comprising a block copolymer, the block copolymer comprising: a first block obtained by imidizing polyamic acid derived from a polymer consisting of a dianhydrous acid component including biphenyltetracarboxylic dianhydride and a diamine component incl...

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Bibliographische Detailangaben
Hauptverfasser:	WON, DONG-YOUNG, CHAE, SU-KYUNG, LEE, KIL-NAM, BACK, SUNG-YUL, CHO, MIN-SANG, JUNG, YOUNG-JIN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON GENERAL PROCESSES OF COMPOUNDING MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP WORKING-UP
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Beschreibung
Zusammenfassung:	The present invention provides a polyimide film comprising a block copolymer, the block copolymer comprising: a first block obtained by imidizing polyamic acid derived from a polymer consisting of a dianhydrous acid component including biphenyltetracarboxylic dianhydride and a diamine component including paraphenylenediamine; a second block obtained by imidizing polyamic acid derived from a polymer consisting of a dianhydrous acid component including biphenyltetracarboxylic dianhydride and a diamine component including m-tolidine; and a third block obtained by imidizing polyamic acid derived from a polymer consisting of a dianhydrous acid component including pyromellitic dianhydride (PMDA) and a diamine component including m-tolidine.