Grinding method

The present invention to provide a grinding method that is capable of reserving, to a maximum extent, an effective area that can be used for products without requiring a considerably long period of time compared to the grinding method used. There is provided a grinding method that is applied when a...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	SUZUKI, YOSHIKAZU, TANEMURA, DAISUKE
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	The present invention to provide a grinding method that is capable of reserving, to a maximum extent, an effective area that can be used for products without requiring a considerably long period of time compared to the grinding method used. There is provided a grinding method that is applied when a workpiece having a first surface and a second surface is to be ground from the second surface. The grinding method includes a first grinding step of causing first grindstones to come into contact with the workpiece to grind the workpiece and thereby form on the workpiece a circular plate-shaped first thin plate portion and an annular first thick plate portion surrounding the first thin plate portion, and a second grinding step of causing second grindstones to come into contact with the first thick plate portion and the first thin plate portion to grind the workpiece and thereby form on the workpiece a thin circular plate-shaped second thin plate portion that has a larger diameter than the first thin plate portion a