Exposure method and exposure system

The present invention addresses the problem of providing an exposure method and an exposure system which make it possible to suppress a decrease in productivity even if the size of an interposer is increased. An exposure method according to an embodiment of the present invention comprises a first exposure step and a second exposure step. In the first exposure step, a first pattern (P1) is exposed on a resist on a substrate using a first exposure device having first exposure accuracy. In the second exposure step, a second pattern (P2) different from the first pattern is exposed on the resist on which the first pattern (P1) has been exposed using a second exposure device having second exposure accuracy different from the first exposure accuracy.