Adhesive sheet, production method for adhesive sheet, roll, and production method for connection structure

The present invention provides a production method for an adhesive sheet 1A for semiconductor device production that comprises a release film 2 and an adhesive film 3 that is provided on the release film 2. The production method for the adhesive sheet 1A includes a preparation step for preparing a b...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	MAEHARA, YASUO, TOMISAKA, KATSUHIKO, TATSUZAWA, TAKASHI, KIKUCHI, KENTA, IZAWA, HIROYUKI, TAKAIRA, HIROSHI, MATSUZAKI, TOSHIAKI, SATO, MAYUMI, FUKUI, TAKAHIRO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CURRENT COLLECTORS DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LINE CONNECTORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES PRINTED CIRCUITS USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The present invention provides a production method for an adhesive sheet 1A for semiconductor device production that comprises a release film 2 and an adhesive film 3 that is provided on the release film 2. The production method for the adhesive sheet 1A includes a preparation step for preparing a backed laminate 8 that comprises a laminate 6 that includes a release film 2 and an adhesive film layer 5 that is provided on the release film 2 and a backing material 7 that is stuck to the release film 2 side of the laminate 6, a laminate cutting step for cutting a cut c1 into the laminate 6 along an arbitrary cutout shape, and a backing material peeling step for peeling the backing material 7 from the laminate 6. During the backing material peeling step, the portion 6A of the laminate 6 that is in the region surrounded by the cut c1 remains stuck to the backing material 7 and is removed.