Thermosetting conductive resin composition and manufacturing method of electronic component

A thermosetting conductive resin composition comprising a conductive powder and a resin binder, wherein the conductive powder including flake-shaped conductive powder, the resin binder includes thermosetting silicone resin having hydroxyl groups, and 25.0 wt% or more of the resin binder has the hydr...

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Bibliographische Detailangaben
1. Verfasser:	ESAKI, SOICHIRO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CAPACITORS CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CONDUCTORS CORRECTING FLUIDS DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FILLING PASTES INKS INSULATORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES PRINTED CIRCUITS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS THEREFOR WOODSTAINS
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Beschreibung
Zusammenfassung:	A thermosetting conductive resin composition comprising a conductive powder and a resin binder, wherein the conductive powder including flake-shaped conductive powder, the resin binder includes thermosetting silicone resin having hydroxyl groups, and 25.0 wt% or more of the resin binder has the hydroxyl groups. With the present invention, it is possible to provide a thermosetting conductive resin composition capable of forming a conductive resin layer with high moisture resistance and excellent conductivity even when using a plurality of types of resin including silicone resin as the resin binder.