Resist composition and method for forming resist pattern

A resist composition is adopted that contains a resin component, which has a constituent unit represented by general formula (a0-1), and a compound, which is represented by general formula (d0-1). In general formula (a0-1), R0 is a hydrogen atom, an alkyl group, a halogen atom or a halogenated alkyl...

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Bibliographische Detailangaben
Hauptverfasser:	FUJINAMI, TETSUO, KATO, HIROKI, ISHII, SHUICHI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON ELECTROGRAPHY HETEROCYCLIC COMPOUNDS HOLOGRAPHY MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MATERIALS THEREFOR METALLURGY ORGANIC CHEMISTRY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	A resist composition is adopted that contains a resin component, which has a constituent unit represented by general formula (a0-1), and a compound, which is represented by general formula (d0-1). In general formula (a0-1), R0 is a hydrogen atom, an alkyl group, a halogen atom or a halogenated alkyl group. Vax0 is a single bond or divalent linking group; Wa is a divalent aromatic hydrocarbon group; Va0 is a divalent hydrocarbon group; na0 is an integer 0-2; and Ra00 is an acid dissociable group. In general formula (d0-1), X0 is a bromine atom or an iodine atom. Rm is a hydroxy group, an alkyl group, a fluorine atom or a chlorine atom. nd1 is an integer 1-5, nd2 is an integer 0-4, Yd0 is a divalent linking group or a simple bond. Mm+ represents an organic cation having a valency of m. m is an integer greater than or equal to 1.