Dresser for polishing pad

Provided is a novel dresser capable of imparting high flatness to a polishing pad. A dresser for a surface of a polishing pad is provided, comprising a circular dressing surface having a diameter DCD and facing the pad surface, and pellets arranged on the dressing surface. The pellets are arranged c...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	SUZUKI, TAKEHIRO, KISHIMOTO, MASATOSHI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TOOLS FOR GRINDING, BUFFING, OR SHARPENING TRANSPORTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	Provided is a novel dresser capable of imparting high flatness to a polishing pad. A dresser for a surface of a polishing pad is provided, comprising a circular dressing surface having a diameter DCD and facing the pad surface, and pellets arranged on the dressing surface. The pellets are arranged concentrically on the dressing surface in a circumferential region having a diameter PCDn. An area ratio of the pellets arranged in the circumferential region is any one of predetermined first, second, and third types.