Workpiece cutting method and wire saw

The present invention is a workpiece cutting method using a wire saw, said method including: a step for cutting a first cylindrical workpiece by using a fixed abrasive grain wire; after completion of the step for cutting the first cylindrical workpiece, a step for rewinding, from a second bobbin toward a first bobbin, a portion of the fixed abrasive grain wire used to cut the first cylindrical workpiece; and, after the rewinding step, a step for cutting a second cylindrical workpiece by using the fixed abrasive grain wire. In the step for cutting the second cylindrical workpiece, cutting of the second cylindrical workpiece is started while feeding the rewound portion of the fixed abrasive grain wire in a direction from the first bobbin toward the second bobbin. Through the above, it is possible to provide: a workpiece cutting method using a fixed abrasive grain wire, whereby unevenness in the thickness of a wafer cut out from a workpiece can be suppressed; and a wire saw that can suppress unevenness in the th