Three-dimensional circuit board and manufacturing method thereof and probe card

A three-dimensional circuit board includes a ceramic substrate and a plurality of circuits. The ceramic substrate has a first plane, a second plane, a three plane between the first plane and the second plane, a first side surface connecting the first plane and the second plane and a second plane con...

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Bibliographische Detailangaben
Hauptverfasser:	HUANG, MENGI, CHOU, MINIEH, HUANG, YUE-ZHEN, KAO, TUNE-HUNE
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS PRINTED CIRCUITS TESTING
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Beschreibung
Zusammenfassung:	A three-dimensional circuit board includes a ceramic substrate and a plurality of circuits. The ceramic substrate has a first plane, a second plane, a three plane between the first plane and the second plane, a first side surface connecting the first plane and the second plane and a second plane connecting the first plane and the three plane and opposite to the first side surface. A first height of the first side surface is greater than a second height of the second side surface. The circuits are separately embedded on the first plane of the ceramic substrate, and extend along the first side surface and embedded on the second plane.