Semiconductor device assemblies including monolithic silicon structures for thermal dissipation and methods of making the same

A semiconductor device assembly is provided. The assembly includes a first semiconductor device including a plurality of electrical contacts on an upper surface thereof; a monolithic silicon structure having a lower surface in contact with the upper surface of the first semiconductor device, the mon...

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Bibliographische Detailangaben
Hauptverfasser: PAREKH, KUNAL R, PAREKH, ANGELA
Format: Patent
Sprache:chi ; eng
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