Process flow of manufacturing a semiconductor device and system for manufacturing a semiconductor device

A process flow of manufacturing a semiconductor device includes the following steps is provided. Establishing a first process rule includes: performing a first process on a first film structure under the first process conditions. Establishing a second process rule includes: performing a second proce...

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Bibliographische Detailangaben
Hauptverfasser: SHIH, PEI-SHAN, LAI, JUNNG, CHANG, YI-SHIANG, LIN, CHIAI
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:A process flow of manufacturing a semiconductor device includes the following steps is provided. Establishing a first process rule includes: performing a first process on a first film structure under the first process conditions. Establishing a second process rule includes: performing a second process on a second film structure under the second process conditions. A semiconductor device manufacturing process is performed according to the first process rule and the second process rule, which includes: performing a first semiconductor device manufacturing process on a first region of a device film structure; and performing a second semiconductor device manufacturing process on a first region of the device film structure. The specifications of the first region are the same as the specifications of the first film layer structure. The specifications of the second region are the same as the specifications of the second film structure. The conditions of the first semiconductor device manufacturing process are the sa