Delamination module and gas assisted bonding equipment including the same

A delamination module capable of effectively peeling a film from a wafer and a gas assisted bonding equipment including the same are disclosed. The delamination module in the gas assisted bonding equipment includes: a tape supply portion configured to supply a tape for peeling the tape; a film peeli...

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Bibliographische Detailangaben

Hauptverfasser:	YU, YEONG-SEON, KIM, SOON-HYUN, PARK, SUUL
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PERFORMING OPERATIONS SEMICONDUCTOR DEVICES TRANSPORTING
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