Delamination module and gas assisted bonding equipment including the same

A delamination module capable of effectively peeling a film from a wafer and a gas assisted bonding equipment including the same are disclosed. The delamination module in the gas assisted bonding equipment includes: a tape supply portion configured to supply a tape for peeling the tape; a film peeling device configured to peel the film from the wafer by using the tape; and a tape recovering portion configured to recover a set of tapes with the film attached thereto. The film peeling device includes: a chuck on which the wafer with the film attached thereon is placed, and configured to move along a horizontal direction; a peeling roller allowing the tape for peeling the film from the wafer to be in contact with the film, and configured to rotate at a speed corresponding to a moving speed of the chuck; and a peeling bar configured to adjust a peeling angle between the film to which the tape is attached and the wafer.