Method for manufacturing led-mounting substrate

The purpose of the present invention is to provide a method for manufacturing an LED-mounting substrate capable of catching micro LED chips at predetermined positions even when the LED chips are transferred by laser abrasion, thereby achieving improved mountability and higher reliability of subseque...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	TAJIMA, IZUMI, MIZUGUCHI, TSUKURU
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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