Method for manufacturing led-mounting substrate

The purpose of the present invention is to provide a method for manufacturing an LED-mounting substrate capable of catching micro LED chips at predetermined positions even when the LED chips are transferred by laser abrasion, thereby achieving improved mountability and higher reliability of subsequent connections. The present invention provides a method for manufacturing an LED-mounting substrate, the method comprising: a step (opposing step) for causing an insulating-layer-formed surface of an LED-mounting substrate, which comprises a substrate having electrodes, bumps formed on the electrodes and composed of a composite material of an organic component and electrically conductive particles, and an insulating layer formed on at least the bumps, to oppose a surface of an LED-transfer substrate comprising a transparent substrate on which a surface having no electrodes of LEDs is bonded, the opposed surface having electrodes of the LEDs; a step (LED transfer step) for irradiating the LEDs with laser from the tr