Semiconductor device structure with stacked conductive plugs and method for preparing the same

The present disclosure provides a semiconductor device structure with stacked conductive plugs and method for preparing the same. The semiconductor device structure includes a first dielectric layer disposed over a semiconductor substrate, a second dielectric layer disposed over the first dielectric...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	CHOU, YI-HSIEN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!