Semiconductor device structure with stacked conductive plugs and method for preparing the same
The present disclosure provides a semiconductor device structure with stacked conductive plugs and method for preparing the same. The semiconductor device structure includes a first dielectric layer disposed over a semiconductor substrate, a second dielectric layer disposed over the first dielectric...
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | The present disclosure provides a semiconductor device structure with stacked conductive plugs and method for preparing the same. The semiconductor device structure includes a first dielectric layer disposed over a semiconductor substrate, a second dielectric layer disposed over the first dielectric layer, a first conductive plug disposed in the first dielectric layer, wherein a top surface of the first conductive plug is greater than a bottom surface of the first conductive plug; and a second conductive plug disposed in the second dielectric layer and directly over the first conductive plug. |
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