Semiconductor package and method for manufacturing the same
In a method for manufacturing a semiconductor package, a conductive wire is formed on a substrate through wire bonding to allow its ball end to be located above the substrate, a molding material is provided to cover the conductive wire except the ball end, and then an EMI shielding layer is formed o...
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | In a method for manufacturing a semiconductor package, a conductive wire is formed on a substrate through wire bonding to allow its ball end to be located above the substrate, a molding material is provided to cover the conductive wire except the ball end, and then an EMI shielding layer is formed on the molding material to connect with the ball end. The area of the conductive wire bonded to the EMI shielding layer is increased because of the ball end visible on the molding material, thereby improving bonding strength and reliability of the EMI shielding layer and conductive wire. |
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