Ceiling heater, semiconductor device manufacturing method, substrate processing method, and substrate processing apparatus

The present invention suppresses the deformation of heating elements. A ceiling heater provided above a reaction tube includes a disk-shaped base material and heating elements continuously spread on the base material over a plurality of areas obtained by dividing a circle centered at the center of t...

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Bibliographische Detailangaben
Hauptverfasser:	SUGIURA, SHINOBU, KOSUGI, TETSUYA
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC HEATING ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	The present invention suppresses the deformation of heating elements. A ceiling heater provided above a reaction tube includes a disk-shaped base material and heating elements continuously spread on the base material over a plurality of areas obtained by dividing a circle centered at the center of the base material into sectors, wherein each of the heating elements spread over the plurality of areas is connected to the heating element in the adjacent area at a predetermined portion, the base material has a groove corresponding to the shape of the heating elements, a wall is formed by portions other than the portion where the groove is provided, and the space between the heating elements respectively spread over the two regions adjacent to each other is configured to be wider than the width of the wall separating the two regions.