Manufacturing method of device chips capable of suppressing hardening of resin layer

The present invention provides a manufacturing method of device chips, which may suppress the hardening of resin layer as compared to that in the conventional method. The manufacturing method of device chips according to the present invention is to divide along predetermined scribe lines for a plate-like workpiece configured with devices in the area on the front side divided by the predetermined scribe lines, so as to manufacture the device chips comprising devices. The manufacturing method of device chip includes: a resin layer forming step for forming a resin layer containing resin in a non-hardening or semi-hardening state on the front side of workpiece; and, a workpiece cutting step for cutting the workpiece along predetermined scribe lines after the resin layer forming step on the back side of the workpiece that is configured with the resin layer on the front side, so as to manufacture the device chip.