Server and heat exchanger

A server and a heat exchanger. The server includes chassis, motherboard, heat source and heat exchanger. Motherboard is disposed in chassis. Heat source is disposed and electrically connected to motherboard. Heat exchanger includes first chamber, heat dissipation plates and fins. First chamber is in...

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Bibliographische Detailangaben
Hauptverfasser:	XIE, MIN-QIAN, XIANG, PIN-YI, SUN, KE, ZHANG, LIAN-FEI, HAN, SHU-KANG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BLASTING CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMPUTING COUNTING DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION ELECTRIC DIGITAL DATA PROCESSING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEAT EXCHANGE IN GENERAL HEATING LIGHTING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MECHANICAL ENGINEERING PHYSICS PRINTED CIRCUITS WEAPONS
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Beschreibung
Zusammenfassung:	A server and a heat exchanger. The server includes chassis, motherboard, heat source and heat exchanger. Motherboard is disposed in chassis. Heat source is disposed and electrically connected to motherboard. Heat exchanger includes first chamber, heat dissipation plates and fins. First chamber is in thermal contact with heat source and has first channel. Heat dissipation plates are in thermal contact with and inserted into first chamber. Heat dissipation plates each have second channel. First channel of first chamber is in fluid communication with second channels of heat dissipation plates. Fins are in thermal contact with heat dissipation plates.