Curable resin composition and interlayer insulating material

The present invention provides a curable resin composition excellent in terms of dielectric characteristics after curing and adhesiveness. Also provided is an interlayer insulating material obtained from the curable resin composition. This curable resin composition comprises a curable resin, a harde...

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Bibliographische Detailangaben
Hauptverfasser:	MASUI, RYOHEI, WAKIOKA, SAYAKA, TAKEDA, KOHEI, OATARI, YUTA, KAMAGA, KEI, HAYASHI, TATSUSHI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	The present invention provides a curable resin composition excellent in terms of dielectric characteristics after curing and adhesiveness. Also provided is an interlayer insulating material obtained from the curable resin composition. This curable resin composition comprises a curable resin, a hardener, an inorganic filler, and a dispersant and has a complex viscosity, as measured at 90 DEG C, 5% strain, and 1 rad/sec, of 8,000 Pa·s or less.