Substrate with film formed thereon

The purpose of the present invention is to provide a novel substrate with a film formed thereon, in which a high-density film is formed on at least a part of a metal surface present on a substrate. Provided is a substrate with a film formed thereon, wherein a film which contains a compound having a...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	SHINOKURA, TOMONORI, MIZUSHIMA, CHIHO, HARIGAE, TAKAKO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PERFORMING OPERATIONS PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SPRAYING OR ATOMISING IN GENERAL TRANSPORTING
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Beschreibung
Zusammenfassung:	The purpose of the present invention is to provide a novel substrate with a film formed thereon, in which a high-density film is formed on at least a part of a metal surface present on a substrate. Provided is a substrate with a film formed thereon, wherein a film which contains a compound having a structural unit derived from a monomer and an adsorption group is formed on at least a part of a metal surface present on a substrate, and the specific gravity of the metal is not more than 19.30 g/cm3.