Processing method of using carbon dioxide laser to perform hole opening on printed substrate characterized by improving work efficiency, reducing work cost, achieving high processing accuracy and preventing the damage of the inner copper foil layer as the inner conductor layer in the insulation layer

Disclosed is a processing method of using carbon dioxide laser to perform hole opening on a printed substrate, in which multiple times of laser irradiation for forming blind holes on a printed substrate is performed by using the continuous pulse wave irradiation and the intermittent pulse wave irradiation. Therefore, the continuous pulse wave irradiation can be used for large-scale processing and then the shooting of the intermittent pulse wave irradiation can be used for accurate processing . Therefore, the heat generated during processing is less, and the heat can be dissipated by using heat conduction at the bottom value of the power, so as to sufficiently cool the insulation layer. Thereby, work efficiency can be the improved, work cost can be reduced, high processing accuracy can be achieved, and the damage of the inner copper foil layer as the inner conductor layer in the insulation layer can be avoided.