Method for manufacturing package substrate for carrying semiconductor element, and laminate with support substrate

To provide: a method for manufacturing a package substrate for carrying a semiconductor element, capable of suppressing damage during peeling of a core resin layer or in a processing step after the peeling; and a laminate with a support substrate. The present invention involves: laminating, on a first metal layer 11B of a first laminate 11 in which a core resin layer 11A and the first metal layer 11B equipped with a peeing means are laminated, wiring conductors from a first wiring conductor 12 through a (n+2)-th wiring conductor 15B, and insulating resin layers from a first insulating resin layer 13A through a (n+1)-th insulating resin layer 15A; laminating thereon a support substrate 16A having a thermoplastic resin layer; and then peeling off at least the core resin layer by the peeling means.