Multilayer body and electronic device that is provided with multilayer body

The present invention provides a multilayer body which is capable of maintaining adhesion of a plating layer not only in a normal state but also after a long-term heat resistance test. This multilayer body is provided with: a supporting body; and a primer layer, a metal particle layer and a metal pl...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	TAKIZAWA, MASAHIRO, SHIRAKAMI, JUN, HIROTA, YOUSUKE, FURUTANI, AKINORI, FUJIKAWA, WATARU
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS TRANSPORTING
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Beschreibung
Zusammenfassung:	The present invention provides a multilayer body which is capable of maintaining adhesion of a plating layer not only in a normal state but also after a long-term heat resistance test. This multilayer body is provided with: a supporting body; and a primer layer, a metal particle layer and a metal plating layer, which are sequentially arranged on the supporting body. With respect to this multilayer body, the metal particle layer contains metal particles, a compound that has a basic nitrogen atom-containing group, and an epoxy resin.