Nanocomposite material for ultraviolet curable direct write semiconductor applications
A chip-embedded printed circuit board includes a cavity in a printed circuit board, a chip in the cavity of the printed circuit board, and a thixotropic dielectric filler in a gap in the cavity to seal the chip in the printed circuit board.
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| creator | AKYURTLU, ALKIM ARMIENTO, CRAIG A PIRO, YURI KINGSLEY, EDWARD D LUCE, ANDREW M KUNCHO, CHRISTOPHER N LAMPORT, EMILY AREIAS, CHRISTOPHER R RANASINGHA, OSHADHA |
| description | A chip-embedded printed circuit board includes a cavity in a printed circuit board, a chip in the cavity of the printed circuit board, and a thixotropic dielectric filler in a gap in the cavity to seal the chip in the printed circuit board. |
| format | Patent |
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| language | chi ; eng |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | Nanocomposite material for ultraviolet curable direct write semiconductor applications |
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