Nanocomposite material for ultraviolet curable direct write semiconductor applications

A chip-embedded printed circuit board includes a cavity in a printed circuit board, a chip in the cavity of the printed circuit board, and a thixotropic dielectric filler in a gap in the cavity to seal the chip in the printed circuit board.

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Bibliographische Detailangaben
Hauptverfasser:	AKYURTLU, ALKIM, ARMIENTO, CRAIG A, PIRO, YURI, KINGSLEY, EDWARD D, LUCE, ANDREW M, KUNCHO, CHRISTOPHER N, LAMPORT, EMILY, AREIAS, CHRISTOPHER R, RANASINGHA, OSHADHA
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	A chip-embedded printed circuit board includes a cavity in a printed circuit board, a chip in the cavity of the printed circuit board, and a thixotropic dielectric filler in a gap in the cavity to seal the chip in the printed circuit board.