Electrical connection structure
An electrical connection structure includes a first substrate, a first conductive pad, a second substrate, a second conductive pad, a through hole and a conductive material. The first conductive pad is disposed on the first substrate, wherein the first conductive pad includes a first upper surface....
Gespeichert in:
Hauptverfasser: | , |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | An electrical connection structure includes a first substrate, a first conductive pad, a second substrate, a second conductive pad, a through hole and a conductive material. The first conductive pad is disposed on the first substrate, wherein the first conductive pad includes a first upper surface. The second conductive pad is disposed on the second substrate, wherein the second conductive pad includes a second upper surface. The through hole penetrates the first substrate and exposes a portion of the second upper surface. The conductive material is partially disposed in the through hole, wherein the conductive material includes a narrowest portion and a first contact portion in contact with the second upper surface. In a cross-sectional view, a length of the first contact portion is greater than a length of the narrowest portion. |
---|