Protective film formation apparatus

Protective film formation apparatus

The invention provides a protective film forming device capable of forming a protective film with a flat surface without causing a load on an element. The protective film forming apparatus includes: a resin supply unit (32) that supplies a liquid curable resin (R) to a surface of a substrate on whic...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: NISHIGAKI, HISASHI
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator NISHIGAKI, HISASHI
description The invention provides a protective film forming device capable of forming a protective film with a flat surface without causing a load on an element. The protective film forming apparatus includes: a resin supply unit (32) that supplies a liquid curable resin (R) to a surface of a substrate on which an element is mounted; a substrate holding unit (33) that holds the substrate to which the curable resin (R) is supplied; a support section (34) provided so as to face the substrate holding section (33); a tape supply unit (35) that supplies an adhesion prevention tape (T) between the substrate holding unit (33) and the support unit (34); a pressing part (36) that presses the substrate toward the support part (34), presses the curable resin (R) supplied to the substrate against the adhesion prevention tape (T), and extends the curable resin (R) on the substrate; a curing unit (37) that cures the curable resin (R) extending on the substrate; and a curing part (38) which is provided around the support part (34) and
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_TW202320253A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>TW202320253A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_TW202320253A3</originalsourceid><addsrcrecordid>eNrjZFAOKMovSU0uySxLVUjLzMlVSMsvyk0syczPU0gsKEgsSiwpLeZhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfEh4UYGRsZAbGrsaEyMGgARWibx</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Protective film formation apparatus</title><source>esp@cenet</source><creator>NISHIGAKI, HISASHI</creator><creatorcontrib>NISHIGAKI, HISASHI</creatorcontrib><description>The invention provides a protective film forming device capable of forming a protective film with a flat surface without causing a load on an element. The protective film forming apparatus includes: a resin supply unit (32) that supplies a liquid curable resin (R) to a surface of a substrate on which an element is mounted; a substrate holding unit (33) that holds the substrate to which the curable resin (R) is supplied; a support section (34) provided so as to face the substrate holding section (33); a tape supply unit (35) that supplies an adhesion prevention tape (T) between the substrate holding unit (33) and the support unit (34); a pressing part (36) that presses the substrate toward the support part (34), presses the curable resin (R) supplied to the substrate against the adhesion prevention tape (T), and extends the curable resin (R) on the substrate; a curing unit (37) that cures the curable resin (R) extending on the substrate; and a curing part (38) which is provided around the support part (34) and</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20230516&amp;DB=EPODOC&amp;CC=TW&amp;NR=202320253A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20230516&amp;DB=EPODOC&amp;CC=TW&amp;NR=202320253A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>NISHIGAKI, HISASHI</creatorcontrib><title>Protective film formation apparatus</title><description>The invention provides a protective film forming device capable of forming a protective film with a flat surface without causing a load on an element. The protective film forming apparatus includes: a resin supply unit (32) that supplies a liquid curable resin (R) to a surface of a substrate on which an element is mounted; a substrate holding unit (33) that holds the substrate to which the curable resin (R) is supplied; a support section (34) provided so as to face the substrate holding section (33); a tape supply unit (35) that supplies an adhesion prevention tape (T) between the substrate holding unit (33) and the support unit (34); a pressing part (36) that presses the substrate toward the support part (34), presses the curable resin (R) supplied to the substrate against the adhesion prevention tape (T), and extends the curable resin (R) on the substrate; a curing unit (37) that cures the curable resin (R) extending on the substrate; and a curing part (38) which is provided around the support part (34) and</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFAOKMovSU0uySxLVUjLzMlVSMsvyk0syczPU0gsKEgsSiwpLeZhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfEh4UYGRsZAbGrsaEyMGgARWibx</recordid><startdate>20230516</startdate><enddate>20230516</enddate><creator>NISHIGAKI, HISASHI</creator><scope>EVB</scope></search><sort><creationdate>20230516</creationdate><title>Protective film formation apparatus</title><author>NISHIGAKI, HISASHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TW202320253A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>NISHIGAKI, HISASHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>NISHIGAKI, HISASHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Protective film formation apparatus</title><date>2023-05-16</date><risdate>2023</risdate><abstract>The invention provides a protective film forming device capable of forming a protective film with a flat surface without causing a load on an element. The protective film forming apparatus includes: a resin supply unit (32) that supplies a liquid curable resin (R) to a surface of a substrate on which an element is mounted; a substrate holding unit (33) that holds the substrate to which the curable resin (R) is supplied; a support section (34) provided so as to face the substrate holding section (33); a tape supply unit (35) that supplies an adhesion prevention tape (T) between the substrate holding unit (33) and the support unit (34); a pressing part (36) that presses the substrate toward the support part (34), presses the curable resin (R) supplied to the substrate against the adhesion prevention tape (T), and extends the curable resin (R) on the substrate; a curing unit (37) that cures the curable resin (R) extending on the substrate; and a curing part (38) which is provided around the support part (34) and</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language chi ; eng
recordid cdi_epo_espacenet_TW202320253A
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Protective film formation apparatus
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-05T10%3A27%3A38IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=NISHIGAKI,%20HISASHI&rft.date=2023-05-16&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ETW202320253A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true