Protective film formation apparatus

The invention provides a protective film forming device capable of forming a protective film with a flat surface without causing a load on an element. The protective film forming apparatus includes: a resin supply unit (32) that supplies a liquid curable resin (R) to a surface of a substrate on whic...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: NISHIGAKI, HISASHI
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention provides a protective film forming device capable of forming a protective film with a flat surface without causing a load on an element. The protective film forming apparatus includes: a resin supply unit (32) that supplies a liquid curable resin (R) to a surface of a substrate on which an element is mounted; a substrate holding unit (33) that holds the substrate to which the curable resin (R) is supplied; a support section (34) provided so as to face the substrate holding section (33); a tape supply unit (35) that supplies an adhesion prevention tape (T) between the substrate holding unit (33) and the support unit (34); a pressing part (36) that presses the substrate toward the support part (34), presses the curable resin (R) supplied to the substrate against the adhesion prevention tape (T), and extends the curable resin (R) on the substrate; a curing unit (37) that cures the curable resin (R) extending on the substrate; and a curing part (38) which is provided around the support part (34) and