Thermosetting composition, cured product thereof, semiconductor encapsulation material, prepreg, circuit board and build-up film capable of achieving both excellent copper foil adhesion and heat resistance

The problem to be solved by the present invention is to provide a thermosetting composition capable of achieving both excellent copper foil adhesion and heat resistance. The present invention provides a thermosetting composition, comprising a thermosetting resin (A), a thermosetting agent (B) and a...

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Bibliographische Detailangaben
Hauptverfasser:	NINOMIYA, ATSUSHI, MIWA, KOUJI, TAKIKAWA, YUKO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP WORKING-UP
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Beschreibung
Zusammenfassung:	The problem to be solved by the present invention is to provide a thermosetting composition capable of achieving both excellent copper foil adhesion and heat resistance. The present invention provides a thermosetting composition, comprising a thermosetting resin (A), a thermosetting agent (B) and a modified resin (C), wherein the thermosetting composition is characterized in that the modified resin (C) is urethane resin made of polyol (c1) and polyisocyanate (c2) as raw materials having isocyanate group content of 0 mol/kg; the glass transition temperature of the modified resin (C) is -100 DEG C to 50 DEG C, the number average molecular weight of the modified resin (C) is 4,000 to 100,000, and the content of the modified resin (C) is 0.1 to 60 parts by mass based on 100 parts by mass of the thermosetting resin (A).